Rethinking MCU Architectures for the AI Era
MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn the important factors—from optimized…
Digilent Unveils Its First All-in-One Test Workbench
The new mixed-signal oscilloscopes also integrate a CAT II digital multimeter, three programmable power supplies, a dedicated trigger line, and an arbitrary…
From Automation to Automotives: The Latest in Interconnect Solutions
New interconnect solutions showcase the industry's commitment to meeting the dynamic needs of factories, cars, Ethernet, and beyond.
Evolving Healthcare Regulations Force Embedded Technology Change
Download this white paper to learn how to simplify product development and increase security with modern platforms.
Qualcomm Brings 5G and Long Battery Life to Billions of Smartphone Users
Qualcomm’s new Snapdragon 4s Gen 2 platform brings 5G data, fast charging, and improved memory performance to low-cost phones worldwide.
The Good and Bad of Grounded Copper Pour: The EMC Perspective
In PCB design, using grounded copper pour can be a double-edged sword. Learn how to make smart design decisions on balancing copper layers, preventing dead…
Researchers Advance Thermal Imaging for Military, Medical Infrared Thermography
Using a non-contact thermometer with a near-infrared (NIR) spectrometer, the team eliminated the need for precise emissivity values.
Introduction to the Class C Power Amplifier
This article examines the operation of the Class C power amplifier and how it compares to its Class A and Class B counterparts.