Some of the leaders of the networking industry showed up to the Optical Fiber Conference, including Broadcom, MediaTek, Semtech, and MaxLinear.
The new Snapdragon 7+ Gen 3 processor comes with CPU and memory performance increases, Wi-Fi 7, and enhanced edge AI capabilities for mobile devices.
Today, NXP announced a new platform and automotive processor that promises more integration and utility in SDVs—no matter the architecture.
With Microchip’s newest dual-pad reference design, designers can start developing with the Qi 2.0 standard.
In this project, which uses the Arduino IDE, we create and demonstrate a digital drawing pad using an ESP32-based e-paper display dev board, rotary encoders for…
The new MCUs focus on power efficiency and high-accuracy analog-to-digital conversion.
The devices meet the AEC-Q100 Grade 1 standard and boast improvements in offset, drift, and power supply rejection ratio
Pragmatic Semiconductor’s Founder and Executive Director joins us to discuss their thin-film, low-cost alternative to traditional silicon manufacturing and…