One Year Later, Renesas Details the Status of Its Reality AI Acquisition
Renesas has a lot to show in the one year since it acquired the startup Reality AI.
With PowerVia Backside Power, Intel Anticipates Big Chip Breakthroughs
Intel has unveiled a new backside power delivery technology called PowerVia, which decouples power and signal interconnects on a wafer to increase performance…
Exploring Output Ripple in a Negative Voltage Charge Pump Using LTspice
In this article, we’ll use LTspice simulations to more thoroughly understand output-voltage ripple and consider techniques for mitigating it within a charge…
Particle Launches Resources To Take IoT from Prototype to Production
At its annual Spectra conference, today Particle is rolling out hardware and software products aimed at making IoT more accessible for all.
Nordic Semiconductor Releases Low-cost Wi-Fi 6 IC Option
The new Wi-Fi companion IC adds Wi-Fi 6 capabilities to an embedded system.
Lee de Forest, the Audion, and the Dawn of the Age of Microelectronics
A scholar, researcher, and tireless inventor, Lee de Forest made a seemingly small modification to vacuum-tube technology. The repercussions in the incipient…
Exclusive—Titan Haptics Debuts Clustered Array to Serve Non-standard Designs
Launched here today, Titan’s clustered array motor approach enables engineers to combine multiple haptic motors into an array that meets their exact application needs.
Intel Makes New Quantum Chip Available to Research Community
Tunnel Falls removes barriers to entry for quantum research by leveraging traditional transistor processes for high-yield fabrication.