Optimization of DC Link Capacitor Bank in OBC Applications through Thermal Management
The electrification of automobiles is creating new requirements at system and component level. The development towards fast charging systems requires onboard…
How to Design a Programmable Gain Instrumentation Amplifier for Precision Wide Bandwidth Signal Chains
Design wide bandwidth programmable gain instrumentation amplifiers (PGIAs).
Qualcomm and Vodafone Team for Next-gen 5G O-RAN Effort
The two companies will continue to collaborate on efforts to expand 5G Open Radio Access Network (RAN) across Europe.
Using 3D Electronic Component Models to Synch PCB and Enclosure Designs
Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design…
Ferroelectric RAM (F-RAM) Hits the Market With Infineon’s EXCELON Family
Infineon has announced a new family of ferroelectric RAM—an energy-efficient, non-volatile memory solution designed for data-critical applications.
Micron Ships its Advanced DRAM 1-beta Node, Targeting Mobile
Claiming it as the industry’s most advanced DRAM technology, Micron Technology has released its advanced 1-beta DRAM node.
How Close Are We to Quantum Commercialization?
While quantum hardware is making significant strides to market, the path to quantum commercialization still has numerous obstacles ahead.
Rethink 5G Testing – How to Implement the Ultimate 5G Device Experience for Suitable Use Cases and Markets
How to implement the ultimate 5G device experience for suitable use cases and markets.