My Favorites From Sensors Converge 2024
A short recap of some of the most interesting technologies I was able to see while walking the show floor this year.
EDA Companies Unite With Samsung for AI and 3D IC Technology
At DAC 2024, leading EDA companies partnered with Samsung to help realize its AI technology roadmap led by process nodes SF2Z and SF4U.
TDK Launches Sensor Partner Program and MEMS Microphone
TDK is building a collaborative ecosystem around its InvenSense MEMS sensors for IoT, wearable, hearable, AR/VR, and robotics applications.
Crafting a Silicon Lifecycle Management Strategy for HPC and Data Centers
As data center computing and HPC advances, the stakes for ensuring reliability are high. Learn how to develop a silicon lifecycle management (SLM) strategy that…
Mystified by Magnetics? Don’t Be!
Join us for a discussion of real solutions to real circuit design problems. Listen and watch as our speakers present real-world examples and show how simple it…
Top EDA Vendors Reveal Plans to Support Intel Foundry
It's DAC 2024 week, and Intel Foundry, the "world’s first systems foundry for the AI era," is getting a boost from top EDA vendors Ansys, Siemens, Cadence, and…
RISC-V Summit Europe News—Processor IP, Verification Tools, and More
At every point in the design process, RISC-V developers can make use of the advancements presented at RISC-V Summit Europe.
Understanding Magnetic Field Energy and Hysteresis Loss in Magnetic Cores
In this article, we use the concept of magnetic field energy to explore the relationship between a core's hysteresis loss and its B-H curve.