Redefining Mission Profiles: NXP’s Approach to Automotive and Non-Automotive Applications

Redefining Mission Profiles: NXP’s Approach to Automotive and Non-Automotive Applications

Delve into EMP Evolution: NXP pioneers extended mission profiles (EMPs) to meet industry demands, spanning automotive and beyond.


industry white papers Sep 27, 2023 by NXP
System Challenges of Generative AI Inference Acceleration

System Challenges of Generative AI Inference Acceleration

When you look under the hood of generative AI processing, the system design challenges are many. Learn how efficiency, power consumption, and memory issues all…


Oil-field Services Company Chooses New AC Programmable Sources to Upgrade Legacy Equipment

Oil-field Services Company Chooses New AC Programmable Sources to Upgrade Legacy Equipment

Oil-field services company turned to AMETEK Programmable Power to replace their aging AC sources used in downhole tooling for drilling operations.


The Power of Wind Turbines: Advancements in Wind Energy Technology

The Power of Wind Turbines: Advancements in Wind Energy Technology

Discover how cutting-edge data acquisition technology is shaping the future of wind energy by downloading the white paper today!


Critical Test Instruments Enhance Gas Turbine Performance

Critical Test Instruments Enhance Gas Turbine Performance

The role of gas turbines in the evolving power and energy industry, emphasizing their reliability and versatility in various applications.


The Benefits of Validating eAxles with the PXB Power Supply

The Benefits of Validating eAxles with the PXB Power Supply

While much EV testing revolves around battery cycle testing with clearly defined charge/discharge cycles, in essence simulating the motor to test the battery,…


New Test & Measurement Tools Rise to Meet the Needs of High-Frequency Devices

New Test & Measurement Tools Rise to Meet the Needs of High-Frequency Devices

New test tools from Siglent, Teledyne LeCroy, and Keysight flex frequency range, accuracy, flexibility, and resolution.


News Sep 26, 2023 by Darshil Patel
Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an…


News Sep 25, 2023 by Duane Benson