Amid an Uncertain US Fab Market, TI Announces 300mm Wafer Fab in Utah
Texas Instruments has announced a second 300-millimeter semiconductor wafer fab in Lehi, Utah, to meet expected growth in IC demand.
In a Series of Agreements, GlobalFoundries Buoys Chip Supply From Home
Tracking the goals of the CHIPS+ Act, GlobalFoundries is strengthening the U.S. semiconductor ecosystem with several partnerships and acquisitions.
Qualcomm and SES-imagotag Team to Leverage New Bluetooth ESL Standard
Industry leaders have their sights set on standardizing smart store labels using the latest Bluetooth SIG standard.
At ISSCC, IMEC Unveils Charge-pump PLL Design for Short Range Radars
At this week’s 70th annual ISSCC event, research firm IMEC is presenting a phase-locked loop (PLL) IC design aimed at automotive and industry radar systems.
Exploring the Basics of Bluetooth Low Energy: A Beginners Guide To BLE
Learn about the Bluetooth low energy (BLE) wireless communication protocol, namely its features, protocol stack, and how it communicates with devices.
MediaTek Ventures Further to High-end Chip Market With Dimensity 7200
MediaTek is upping the competition in the high-end smartphone market with the release of a new mobile processor.
MIT and Caltech Team Up on Ingestible Sensor That Pinpoints GI Issues
The two powerhouse research centers developed an ingestible capsule containing a magnetic sensor and wireless transmitter to monitor GI motility.
Intel Lifts the Curtain on ‘Sapphire Rapids’ Workstation Processors
For years, Intel has been steadily upping the core count for its desktop processors. Now, the company is following suit with its high-end workstation processors.