Measuring On-Chip Heat: Reading the Internal Temperature Sensor on the EK-RA8D1
Learn how to read the internal temperature sensor on the Renesas EK-RA8D1 using the ADC, factory calibration data, and e² studio to monitor die temperature…
Agentic AI Takes the Stage at OCP Global Summit 2026
Intel, AMD, and Arm each made agentic AI announcements this week at OCP 2026, covering rack processor units, rack architecture, and benchmarking
Why Component Availability Belongs Inside Schematic Design
Checking part availability only after the schematic is done invites costly redesigns. Here's how moving that check into the design phase itself avoids the risk.
Microchip Unwraps New 10BASE‑T1S ICs to Scale Edge Connectivity
Two transceivers and a family of endpoints with integrated transceivers add to Microchip’s single pair Ethernet portfolio.
Summit 2026 - Precision Timing: The Silent Dependency in High-Reliability Systems
Timing failures rarely announce themselves. They usually surface as system instability. Join us for a look at how SiTime's precision timing solutions keep that…
Summit 2026 - The Advantages of Reverberation Chambers for Automotive EMC Testing
EMC testing is getting more complex. Discover how reverberation chambers deliver fast, repeatable, energy-efficient stress testing for autonomous, connected,…
Summit 2026 - Optimizing Silicon MOSFET Performance in High-Frequency DC-DC Converters
Explore MOSFET tradeoffs in high-frequency DC-DC converters through 65 W HFQR and 204 W quarter-brick designs with experts from iDEAL Semiconductor.
Summit 2026 - Industrial Connectivity: Applications Driving the Next Wave of Growth
Join experts from Molex to explore how industrial connectivity supports reliable power, signal, and data solutions as connected operations expand beyond the…