Scaling Down: Intel Boasts RibbonFET and PowerVia as Next IC Design Solution
As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC industry through backside power…
Tape Out On Time With On-Demand Signoff DRC in P&R
This white paper looks at the challenges of ever-increasingly complex designs packed into each die and explores techniques that can be used to close designs…
Breaking 5G Barriers: Qualcomm’s Snapdragon x65 Speeds Through 10 Gbps
Breaking the 10 Gbps ‘barrier’ might be the point where mobile broadband starts to match the functionality of fiber services. Qualcomm’s modem-RF system…
Driving Motors in Battery-powered IoT Systems
Learn motor driver design techniques to help extend battery life in battery-powered motor systems.
Intel’s Roadmap Targets Through-silicon Via Issues in Foveros Technology
Knowing the issues with Foveros technology, Intel includes improvements, from interference to power consumption, into its roadmap. How is Intel aiming to improve…
Fueling LiDAR Technology: 3 Startups Aim to Fast-track Autonomous Driving
As the battle for autonomous driving heats up, more companies are investing in LiDAR. From improved sensing to a smaller design, three startups are adding fuel…
Intel’s Latest Roadmap Shakes Up Past Plans and Ditches Node Nomenclature
Meeting goals sometimes means adjusting and overhauling the original plan. From new technology to updated nomenclature, Intel is trying to do just that with its…
Arm’s Startup Day Shows its Support for Future Hardware Startups
Finding new tech often means looking at startups. To support this critical aspect of the tech industry, Arm launches its "Startup Day" event. What is it, and…