Supporting the Future: Semiconductor Manufacturers Focus on College Training Resources
Though there are many advantages of semiconductor manufacturers investing in EE education through funding university programs and projects, there are also…
Kontron SMARC™ 2.1 Modules Enable Next-Gen IoT and AI-enabled Embedded Applications
This whitepaper by Kontron explores how the SMARC™ specification continues to evolve to address challenges and remain fit-for-use in cost-effectively…
Learn About the Basics of LVDT Demodulator Circuits
Learn where demodulator circuits are needed and how you can convert the AC output of an LVDT (linear variable differential transformer) into DC signals using a…
Solving Quantum Challenges with Photonic Quantum Chips
Though research on quantum computing is booming, there are still many real-world challenges to overcome, though photonic quantum chips might help.
Reaching Towards 2D Memory: Is Magnetic Graphene and Spintronics the Key?
Recent research spurs the prospect of 2D layered materials having the potential to play a significant role in memory and data processing applications.
“World’s Smallest” BLE Module Emerges from Toshiba and Nordic Semi Team-up
Capitalizing on a 14.1% market growth in the 2020 wearable IoT market, Toshiba and Nordic Semiconductor partner to bring the world’s smallest BLE module.
Computer-on-Module for High Performance Computing
Learn how the long-established COM Express standard for Computer-on-Modules (COM) has been combined with a new high-performance computing standard.
Power Supplies and Harsh Environments
In this article, we will discuss power supplies in harsh environments, the challenges, solutions, and available in-market products.