Hydrogen Fuel Cells Take to the Sky to Power Commercial Aircrafts
Hydrogen-fueled aviation could be a common reality within the next 15 years, according to a new report.
Can Wide-Bandgap Devices Help Lead to a Carbon-Neutral Future?
STMicroelectronics announced a goal to be carbon neutral by 2027, and they plan to get there by using wide-bandgap semiconductors. How might this technology…
Junction-to-Case Thermal Resistance in Thermal Design
Learn about an important thermal metric for designing the interface between an IC package and a heat sink.
Efforts to Bring Chip Manufacturing to U.S. Soil Will Continue in 2021
The U.S. government has made big pushes for domestic chip manufacturing in 2020. What does this trajectory look like for 2021?
A New Manufacturing Method May Pull Nanowires From the Research Realm to Market
Nanowires are seeing drastic advances in academia, emphasizing the promise that they offer the optoelectronics industry.
Theta JA (θJA) Test Conditions for Assessing IC Package Thermal Design
Junction-to-ambient thermal resistance (or θJA) should be measured under standardized testing conditions. Learn about these details to use this thermal metric…
Introducing Social-Distanced Testing to Space Industry
This webinar from Rohde & Schwarz provides an overview on related test and measurement solutions and explains how engineers can control test equipment remotely…
Researchers Propose A New “Unhackable” Transistor
Protecting IP is a serious concern in the semiconductor industry, where threats like counterfeiting, reverse engineering, and piracy run rampant. Researchers…