NI Connect 2025: Emerson Announces Big Hardware, Software Upgrades to T&M
The annual NI Connect 2025 conference showcases developments in data acquisition, AI-enhanced LabVIEW, and a software-defined RF platform.
Renesas Rolls Out MCUs for Low-Power Designs in Tough Conditions
Renesas claims the RA0E2 MCUs feature top-tier energy efficiency, thermal reliability, and software compatibility for embedded designs under tight constraints.
JEDEC Officially Releases HBM4 Memory Standard
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved efficiency for AI and HPC.
Efficient Battery Management System Testing: Streamlining Your BMS ATE Approach
Unlock strategies to streamline your BMS testing with proven ATE methods—download the guide now.
How Phasors Help Us Understand Bandpass Signals
Using phasors, we explore how real-valued bandpass signals are represented as complex baseband signals in the models used by RF communication systems.
Melexis’ Thermographic Sensor Overcomes Cost and Accuracy Bottlenecks
Melexis says the new sensor provides direct temperature reporting without a dedicated MCU.
Solar on Top, Sensors on Bottom: Smart Insole Offers Biometric Insights
The smart insole combines solar power, pressure sensors, and AI to catch early signs of conditions from plantar fasciitis to Parkinson’s disease.
ST Outfits Its Automotive MCUs With a Next-Gen Extensible Memory
With more memory-hungry AI applications around the corner, ST is future-proofing its automotive MCUs with a new solution based on its phase-change memory technology.