Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and…
How SoC Integration Impacts SMT Assembly Yield
Learn how SoC integration impacts SMT assembly yield, from fine-pitch BGA challenges and package warpage to reflow profiling and inspection strategies.
SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization
The MEMS-based oscillator delivers less than 1 nanosecond of time synchronization accuracy for AI clusters.
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.
Designing for a Medical Application: Choosing the Right Power Partner
Explore how to evaluate medical power supply vendors, strengthen compliance efforts, and support safer medical device designs.
Class AB vs. Class D: Understanding the Trade-Offs for Piezo Driver Design
In this article, we explore when to choose a Class AB or Class D output stage for your piezo amplifier design. We'll also examine the Class D stage's power…
Optical Brain Research Pushes Smaller Implants, Sharper Imaging
Cornell, MIT, and HKUST teams have reported laser- and photonics-based devices that record neurons, image deeper, and tame crosstalk in all-optical neuroscience.
The LM386: How National Semiconductor Put a Speaker Amplifier in Eight Pins
Developed in the mid-1970s, National Semi’s LM386 collapsed a complete audio output stage into a single DIP-8 package running off a 9-V battery—and it became…