TI showcased what it calls the industry's first GaN IPM for compact, energy-efficient motors at PCIM 2024 in Germany.
Rich resources are available today for crafting an enclosure using 3D printing. But where to begin? In this article, learn—step by step—how to design your…
Infineon, Qorvo, and EPC, among many others, are showing off the latest and greatest in FET technology at PCIM Europe.
Onsemi’s 7th generation IGBT modules simplify design and reduce costs in high-power applications. Onsemi spoke with us about the products unveiled at PCIM 2024…
The formation of eddy currents can cause problems for magnetic cores at high frequencies. To mitigate these undesirable effects, we first need to understand them.
The new inertial measurement unit integrates edge processing and analog sensing into a single package.
Find out how to overcome challenges with Synopsys Platform Architect for Multi-Die, a SystemC™ standards-based performance and power analysis tool for early…
Learn how Synopsys' verification solutions tackle the unique challenges of multi-die design, ensuring functionality, correctness, power intent, and inter-die…