At Embedded World, Renesas 365 Advances to General Availability Phase
The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.
MIT Pioneers Two-Chip Authentication to Secure Cryptographic Schemes
MIT's CMOS technique creates paired chips with identical “fingerprints” that secure hardware authentication without storing cryptographic keys on external servers.
The Legacy of Switzerland’s First Female Engineering Professor
To celebrate Women's History Month, we spotlight Erna Hamburger, an engineer who graduated top of her class at EPFL in 1933 and spent decades breaking…
R&S and Realtek Validate First Test Setup for BLE High Data Throughput
Rohde & Schwarz and Realtek have demonstrated a test solution for the upcoming Bluetooth LE High Data Throughput (HDT) feature that can enable verification of…
Constructing a Solar-Powered Snake Robot
Learn how to create a batteryless crawling robot using basic electronic components and a 3D-printed chassis.
Guide to Lean Requirements for Space Engineering
Optimize your space‑engineering workflows with practical strategies to modernize requirements management, improve traceability, and prevent costly project…
Siemens Adds Agentic AI to Questa One to Speed IC Design
A new human-centered toolkit includes goal-driven autonomous agents within established verification environments.
NXP Launches Tiny Applications Processor Blending AI NPU and Tri-Radio
NXP claims that this device represents the first time an applications processor has combined a dedicated AI NPU with tri-radio wireless connectivity.