Accelerating Electronics Development: Beyond the Limits of Legacy Tools
Join us to see how modern workflow platforms transform design by enabling better teamwork, streamlining design processes, and accelerating the delivery of…
Nordic’s Integrated SoC to Simplify Edge AI for Battery-Powered IoT
Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference and easier developer workflows.
Case Study: A Low-Cost, Low-Profile 6kW, 800 V to 12.5 V DC-DC for AI Power
Learn how GaN technology enables a low-cost, low-profile 6 kW, 800 VDC to 12.5 VDC converter using an ISOP LLC topology. This meets the design needs of next-gen,…
CES Memory Roundup: Companies Tackle Bandwidth, Power, and Reliability
Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.
Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen…
Infineon First to Roll Out Wi-Fi 7, 20-MHz Tri-Radio Device for IoT
At CES 2026, Infineon showcased a new family of radio chips integrating Wi-Fi 7, Bluetooth LE 6.0, and IEEE 802.15.4 Thread.
How Brain-Inspired Hardware Is Learning to Scale
While brain-inspired computing and neural interfaces have long promised transformative advances, scaling those systems has remained a challenge. New research…
Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’
At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like future with solid-state 4D FMCW sensing.