Proposed standardization of chiplet models for heterogenous integration
In this paper by Siemens, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal,…
Ep. 43 | Mark Papermaster: The EE and Exec Behind Apple, IBM, Cisco, and AMD’s Success
What hasn’t Mark Papermaster accomplished? He’s the engineer and exec who impacted Apple’s iPhones and iPods, the IBM Power PC, and has led AMD's…
IBM Researcher Reveals Details on Quantum Entanglement Forging
IBM Quantum has introduced entanglement forging, a technique to double the size of systems that can be simulated using quantum hardware. We spoke to one of the…
Fred Pt® Gen 5: the Optimized Solution for Charging Applications
Explore how with Fred Pt® Gen5 Ultrafast technology, Vishay is setting a new benchmark in terms of efficiency and robustness for charging applications,…
The Pros and Cons of Moving EDA to the Cloud
Taking EDA to the cloud, Synopsys’ new software-as-a-service (SaaS) offerings for EDA and IC design raise the question: is cloud computing a good choice for…
What is it About Audio Distortion? Understanding Nonlinearity
Learn about how system nonlinearity creates distortion in audio signals that impacts the sounds we hear. We will examine sine waves, harmonics, and…
From Collabs to Laser Modules—Efforts to Improve AR/VR Technology Keep on Rolling In
Trying to keep the momentum building for AR/VR technology, Google targets a micro-LED company, Microsoft and Qualcomm teaming up, and ams OSRAM has a new laser…
DesignCon 2022: Automated Software Targets IEEE 802.3 Cabling
To support advanced IEEE 802.3 networking standards and shrinking test times, Rohde & Schwarz debuted two new software suite options for doing automated testing…