Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking
Announced today, the new solution leverages existing hardware to expand the range of logistics tracking systems.
Second-Order Type-2 PLLs: Bode Diagrams, Bandwidth, and Overshoot
Learn how to select the zero frequency, damping factor, and loop bandwidth for one of the most popular PLL configurations.
Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs
Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers…
Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure
The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.
Rethinking ZIF Connectors: What Today’s FFC/FPC Solutions Can Actually Do
This technical session examines the most common misconceptions—fragile actuators, weak retention, assembly challenges, cable tolerances, and performance…
Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics
Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating…
IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program
The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.
AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs
Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.