Efficiency Meets Innovation: Discover Infineon’s CoolSET™ for Auxiliary Power Supplies
Join Infineon’s webinar to explore how CoolSET™ solutions simplify power supply designs. Reduce components, enhance efficiency and reliability, and leverage…
How Hybrid-Driver TWS Earbuds Are Reengineering Consumer Audio Hardware
Learn the hybrid design configurations used in today’s TWS earbuds, along with the engineering challenges that OEMs face when designing hybrid models.
Breaking the Bottleneck: How Smart Tools Are Revolutionizing Engineering Design Workflows
VDI (Vital Data Intelligence) Compliance Insights couples Accuris’ data on over 1.2 billion electronic parts with EETech’s VDI Platform.
European Project to Repurpose Fiber-Optic Cables Into Photonic Sensors
An Aston University-led initiative aims to turn existing telecom cables in railways into real-time early warning systems for structural failures.
Secure by Design, Compliant by Default: Navigating the Cyber Resilience Act with NXP and Digi
The Cyber Resilience Act (CRA) significantly reshapes the global product compliance landscape by embedding strict cybersecurity obligations into the framework…
Toshiba Improves MOSFET Performance With Advanced Packaging
Toshiba’s SOP Advance(E) package yields lower losses and better thermal performance.
Powering EVs: Microgrids & DC Charging Solutions
Antonio Di Vaira, Senior VP at Schneider Electric, breaks down how we can meet rising energy demands with smarter, more flexible solution using microgrids, local…
UCLA and Broadcom Team Up to Craft Wafer-Scale Unidirectional Imager
A new multilayer diffractive optical processor blocks images in one direction while passing them in the other.