OKI Reaches New Heights With a 124-Layer PCB
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.
Poster: What Test & Measurement Instruments Do You Need to Test Your Device?
This poster provides a concise visual guide to essential test and measurement instruments such as oscilloscopes, spectrum analyzers, power supplies, and signal…
Secure Interfaces for Critical Semiconductor Applications
Download the white paper to explore best practices for safeguarding semiconductor interfaces.
Intel and AMD CPUs Prove Interoperable With Marvell’s CXL Portfolio
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.
Rugged, Fast, and Flexible: New Connectors Tackle Tough Environments
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Beyond Copper and Optical, a New Interconnect Eyes Next Gen Data Centers
Both copper and optical interconnects face limitations as choices for next gen data centers. Learn how a third option promises to enable scaling up AI clusters…
‘Cameras Today Are Almost Blind’: Startup Eyeo Provides ‘Perfect Sight’
Announced today, Eyeo’s new optical waveguides separate colors for digital camera sensors without lossy filters, promising to make image sensors three times…
6G Spectrum and Waveforms — Enabling the Next Generation of Wireless
Explore the 6G spectrum landscape, standardization roadmap, waveform candidates, and test solutions for signal generation and analysis — key elements in…