EW ‘25 Exclusive—Nuvoton’s President Talks AI, Automotive, IoT, and Sustainability
We talked with Nuvoton President Hsin-Lung Yang in this exclusive Embedded World 2025 interview. Our topics covered AI embedded development, automotive, IoT,…
Introduction to the Feed-Forward Linearization of RF Power Amplifiers
Learn about an important design technique for high-power RF transmitters: feed-forward linearization, which operates on the principle of distortion signal cancellation.
It Was Technology Innovation Galore at Embedded World 2025
Enjoy this fresh crop of technology news from the Embedded World 2025 trade show in Nuremberg, Germany.
Exclusive Interview—AMD Discusses Edge AI, Embedded x86, Adaptive SoCs, and More
In this exclusive Embedded World 2025 interview, we talk to AMD’s Kirk Saban about edge AI, ASICs vs. FPGAs, Adaptive SoCs, embedded x86, and the outlook ahead.
Navitas Introduces World’s First Bidirectional GaN Power ICs
The compact design eliminates bulky components, increases efficiency, and reduces costs in renewable energy and electric vehicles.
Congatec Leverages New COM and Cooling Solution to Beat the Edge AI Heat
Together, the new solutions skirt the heat associated with AI compute without compromising performance.
Weebit’s ReRAM Is Now AEC-Q100 Qualified. What Does That Mean?
Announced at Embedded World 2025, Weebit Nano's ReRAM module has met a critical benchmark for ICs used in vehicles.
Researchers Devise More Washable, Flexible, and Connected Electronics
Researchers are rethinking how electronics interact with the world, from fabrics that respond to gestures without touch to chips that generate terahertz waves…