Introduction to FPGA Design with Efinix

Introduction to FPGA Design with Efinix

Watch this webinar to learn about Quick Instruments (QI) — a test & measurement framework that loads itself into on-board FPGAs for test, validation or…


industry webinars Dec 10, 2024 by TRS-STAR
AMD Reveals Adaptive SoCs With RF Conversion and 80 TOPS DSP

AMD Reveals Adaptive SoCs With RF Conversion and 80 TOPS DSP

Announced today, the new series integrates RF-sampling converters and high-performance compute on a single chip.


News Dec 10, 2024 by Jake Hertz
Broadcom Reaches New Processing Heights With Stacked Die and Face-to-Face Chiplets

Broadcom Reaches New Processing Heights With Stacked Die and Face-to-Face Chiplets

The new configuration increases computing core area within the same overall processor package dimensions.


News Dec 09, 2024 by Duane Benson
Infineon, Littelfuse, and Toshiba Release High-Performance Power MOSFETs

Infineon, Littelfuse, and Toshiba Release High-Performance Power MOSFETs

In today’s MOSFET roundup, we examine three new products hitting on critical power design features: efficiency, power, and protection.


News Dec 09, 2024 by Duane Benson
Create Your Own Stylus-Controlled Synthesizer

Create Your Own Stylus-Controlled Synthesizer

In this project article, we'll use a 555 timer IC to build an iconic musical instrument from the early days of synthesizers.


Crop of New SoCs, Eval Kits, and Modules Support Booming IoT Demand

Crop of New SoCs, Eval Kits, and Modules Support Booming IoT Demand

Releases from Silicon Labs, Morse Micro, and U-blox are bringing new IoT solutions to the hands of engineers.


News Dec 06, 2024 by Jake Hertz
SemiQon Develops First CMOS Transistor to Operate at Cryogenic Temps

SemiQon Develops First CMOS Transistor to Operate at Cryogenic Temps

The quantum hardware company claims its cryo-CMOS transistor solves two critical roadblocks to quantum computing: scaling and cooling costs.


News Dec 05, 2024 by Luke James
Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along with advanced electronic design automation…