Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics
Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating…
IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program
The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.
AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs
Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.
Raspberry Pi Introduces Its First HAT Product for Generative AI
Raspberry Pi's new AI HAT+ 2 adds higher-performance neural acceleration and memory support to extend generative workloads on Raspberry Pi 5.
Enabling Fast Electric Vehicle Charging Tutorial
This tutorial explains how rising electrification is driving the need for ultra-fast, scalable EV charging systems that operate at higher power levels while…
ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs
ST says its new microprocessors balance application-class performance, real-time control, and power management.
Syslogic Reveals GNSS Expansion Board for Centimeter-Accurate Navigation
The add-on board, based on U-blox's X20, brings all-band GNSS, RTK, and HAS-ready corrections to Syslogic's embedded platforms.
Next-Generation Power Management Is the Key to Next-Level Computing
Unlock smarter power delivery strategies for AI servers with this next-generation data center design guide.