Taoglas Upgrades Antenna Tool With AI Modeling, PCB Templates, and More
Taoglas has rolled out a major update to its Antenna Integrator tool, adding AI-enhanced modeling, realistic PCB-shape templates, and new export features aimed…
Wolfspeed Launches 1200 V SiC Six-Pack Power Modules Targeting E-Mobility
The Gen-4 modules aim to increase current capability and extend e-mobility inverter lifetime.
New Performance Boost: COM Express® mini with 13th Generation Intel® Core™ Technology
Download the white paper to see how the new COM Express® mini modules deliver maximum Intel® Core™ performance in ultra-compact, rugged edge-computing designs.
COM-HPC® Server Modules: High-Performance Basis for Compact Edge Servers
Unlock the full white paper to discover how COM-HPC® Server Modules enable ultra-robust, high-performance edge servers built for harsh environments.
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
Discover how Winbond’s low-power memory and Customized Memory Solutions (CMS) advance sustainable, high-performance design for AI, automotive, and industrial…
Analyzing First-Order PLLs Using Linear Models
In this article, we'll use the linearized model of a first-order PLL to understand its response to a simple input change. We'll then use Matlab simulations to…
Analog Devices Rolls Out Rail-to-Rail Amplifier With Low Supply Current
ADI built the new dual amplifier to improve low-power, single-supply designs.
Toshiba Adds Zener Diode Series for Better Circuit Reliability
The CMXBxxA Zener diode lineup also cuts leakage and simplifies upgrades for power line protection.