Understanding Pulse‑Amplitude Modulation: Natural‑Sampling Explained

Understanding Pulse‑Amplitude Modulation: Natural‑Sampling Explained

Multiplying a message by a pulse train replicates its spectrum at every harmonic. See why a 1/3 duty cycle and 4x oversampling stretch the bandwidth roughly 12-fold.


Tracking Time and Date: Implementing a Real-Time Clock on the FPB-RA8E1

Tracking Time and Date: Implementing a Real-Time Clock on the FPB-RA8E1

Learn how to configure the real-time clock on the Renesas FPB-RA8E1 using e² studio and FSP to set the date and time and watch the calendar roll over to a new…


Omnivision Unveils AI Companion Processor for Always-On Parking Surveillance

Omnivision Unveils AI Companion Processor for Always-On Parking Surveillance

The OAX7700 ASIC adds an NPU and pre-roll video capture to cut parking surveillance power consumption by 97%.


News Oct 09, 2026 by Jake Hertz
The LM339: A Quad Comparator in Everything From Chargers to Motherboards

The LM339: A Quad Comparator in Everything From Chargers to Motherboards

National Semiconductor packed four single-supply comparators into one cheap package and created one of the most widely used analog ICs ever made.


News Oct 09, 2026 by Luke James
How a Centralized Architecture Breaks the Radar Edge Processing Bottleneck

How a Centralized Architecture Breaks the Radar Edge Processing Bottleneck

Streaming raw ADC data to a central ADAS SoC removes the edge compute bottleneck in automotive radar, cutting module power while enabling denser point clouds and…


Overcoming Signal Integrity and Thermal Bottlenecks in AI-enabled Sensors

Overcoming Signal Integrity and Thermal Bottlenecks in AI-enabled Sensors

Designing compact AI sensor nodes forces signal integrity and thermal management to compete for limited PCB copper, creating severe PDN and thermal bottlenecks.


STMicro Unwraps Context-Aware Sensors Built With Sustainable Materials

STMicro Unwraps Context-Aware Sensors Built With Sustainable Materials

The LSM6DSK320X and ISM6HGK256X combine low-g and high-g measurement in a 2.5 mm x 3 mm package using lead-free, BPA-free materials.


News Oct 08, 2026 by Luke James
LTCC Solutions for Next Generation

LTCC Solutions for Next Generation

Download LTCC Solutions for Next Generation UWB/BLE Devices to explore how advanced LTCC technology can enable compact, high-performance RF solutions for…