Nvidia Issues Major Update of CUDA Toolkit to Accelerate CPUs and GPUs

Nvidia Issues Major Update of CUDA Toolkit to Accelerate CPUs and GPUs

CUDA Version 13 features new CPU resources, unified Arm platforms, and additional operating systems supported.


News Aug 21, 2025 by Duane Benson
Novosense Unwraps Trio of Chips for GaN, Automotive, and Battery Safety

Novosense Unwraps Trio of Chips for GaN, Automotive, and Battery Safety

The company is launching devices across the gamut of power applications, including a GaN driver, dual-channel automotive driver, and battery-protection MOSFET.


News Aug 20, 2025 by Joshua Tidwell
Efficiency Meets Innovation: Discover Infineon’s CoolSET™ for Auxiliary Power Supplies

Efficiency Meets Innovation: Discover Infineon’s CoolSET™ for Auxiliary Power Supplies

Join Infineon’s webinar to explore how CoolSET™ solutions simplify power supply designs. Reduce components, enhance efficiency and reliability, and leverage…


How Hybrid-Driver TWS Earbuds Are Reengineering Consumer Audio Hardware

How Hybrid-Driver TWS Earbuds Are Reengineering Consumer Audio Hardware

Learn the hybrid design configurations used in today’s TWS earbuds, along with the engineering challenges that OEMs face when designing hybrid models.


Breaking the Bottleneck: How Smart Tools Are Revolutionizing Engineering Design Workflows

Breaking the Bottleneck: How Smart Tools Are Revolutionizing Engineering Design Workflows

VDI (Vital Data Intelligence) Compliance Insights couples Accuris’ data on over 1.2 billion electronic parts with EETech’s VDI Platform.


European Project to Repurpose Fiber-Optic Cables Into Photonic Sensors

European Project to Repurpose Fiber-Optic Cables Into Photonic Sensors

An Aston University-led initiative aims to turn existing telecom cables in railways into real-time early warning systems for structural failures.


News Aug 19, 2025 by Jake Hertz
Secure by Design, Compliant by Default: Navigating the Cyber Resilience Act with NXP and Digi

Secure by Design, Compliant by Default: Navigating the Cyber Resilience Act with NXP and Digi

The Cyber Resilience Act (CRA) significantly reshapes the global product compliance landscape by embedding strict cybersecurity obligations into the framework…


industry white papers Aug 19, 2025 by NXP
Toshiba Improves MOSFET Performance With Advanced Packaging

Toshiba Improves MOSFET Performance With Advanced Packaging

Toshiba’s SOP Advance(E) package yields lower losses and better thermal performance.


News Aug 19, 2025 by Jake Hertz