How Low-Voltage GaN FETs Are Enabling Multi-kW 800 V Isolated Converters
Learn how EPC’s multi-stage ISOP architecture uses low-voltage GaN FETs to efficiently convert 800 V DC in AI data centers, reducing output ripple and…
Tektronix Unveils Industry’s First 8 Channel, 25 GHz Oscilloscope
The DPO718AX extends the year-old 7 Series platform with eight synchronized high-bandwidth channels in a single 8U rack-mount instrument.
An Arduino-Compatible Joystick Interface for RS-485 Motion Control
This project brief describes how to build and use an Arduino-compatible interface board that reads a 2-axis thumb joystick and transmits its position over an…
Recent Semiconductor Deals Reflect Uptick in AI and Quantum Development
Recent semiconductor business moves from Nvidia, MediaTek, GlobalFoundries, Qualcomm, Amazon, and Analog Devices highlight growing investment in AI…
Automated 3D Reconstruction: How Chipmakers Can Keep Pace in the AI Era
As chipmakers stack dies vertically to meet surging AI demand, 2D imaging is losing its edge. Automated 3D reconstruction is becoming essential to keeping fabs on pace.
Validating Robotics & UAV Systems
Download the Validating Robotics & UAV Systems: Integration & Risk Checklist to help identify integration risks, validate critical subsystems, and assess system…
AtlasBase Debuts Bio-Silicon Chip for Breaking Data Center Storage Bottlenecks
Announced today by AtlasBase, Thalia is a 5.6B-well bio-silicon chip that uses synthetic DNA to break power and density bottlenecks in AI data center storage and…
Inside a Multi-$Billion IP Engine Driving IC and EDA Innovations
John Koeter, former SVP of IP at Synopsys (retired), joins the podcast to discuss how pre-designed silicon blocks are accelerating chip development in the age of…