How Low Can You Go? Pushing the Limits of Transistors - Deep Low Voltage Enablement of Embedded Memories and Logic Libraries to Achieve Extreme Low Power
Learn how deep low-voltage enablement of embedded memories and logic libraries can dramatically reduce power while preserving PPA in advanced SoC designs.
Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification
Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.
Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers
The new stepper motor driver adds advanced microstep control to reduce noise, vibration, and power consumption in compact motor systems.
Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking
Announced today, the new solution leverages existing hardware to expand the range of logistics tracking systems.
Second-Order Type-2 PLLs: Bode Diagrams, Bandwidth, and Overshoot
Learn how to select the zero frequency, damping factor, and loop bandwidth for one of the most popular PLL configurations.
Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs
Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers…
Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure
The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.
Rethinking ZIF Connectors: What Today’s FFC/FPC Solutions Can Actually Do
This technical session examines the most common misconceptions—fragile actuators, weak retention, assembly challenges, cable tolerances, and performance…