In the past month, LiDAR has made headlines in meteorology, archeology, and vehicle autonomy.
With an eye on the semiconductor engineering shortage, Purdue University has launched a six-component flexible study program.
In this application note, EA Elektro-Automatik discusses areas of application, validity, auxiliary power supply requirements, test application setups, and…
A new oscilloscope may ease the pain points of designing and debugging devices using the I3C communication protocol.
A new family of four microcontroller units (MCUs) from NXP strives to provide something for everyone designing for edge AI.
Intel is getting creative in how it addresses manufacturing slowdowns—this time, by doubling up on capacitors for both sides of the ABF substrate.
The new building automation solutions from onsemi aim to incorporate essential components that serve the needs of a modern smart home system
This article is a primer into the basics of RISC-V. The open architecture philosophy is exposed, along with a technical description of the modular ISA, and some…