Take Our 2025 EETech Engineering Insights Survey
Join your engineering community peers and take our EETech Engineering Insights Survey 2025. You’ll get a summary of the results once they’re released. And…
Rugged by Design: PCB Design for Harsh Environments
PCBs often face extreme conditions such as heat, vibration, moisture, and electromagnetic interference. Summit Interconnect's "Designing PCBs for Harsh…
BrainChip’s Cloud Platform Lets Developers Use Its Neuromorphic Tech
The new Akida Cloud is developed for instant access to the company's innovations and reduced development cycles.
Nexperia Targets USB With New PD Controllers and ESD Protection Diodes
Nexperia has introduced two programmable USB Type-C power delivery controllers and new ESD protection diodes for high-speed applications exceeding 10 GHz.
Antenna Innovations Come in Sizes Ranging from a Stamp to a School Bus
In this roundup, we spotlight small, medium, and large antenna announcements fortifying communication across industries, from drones to satellites.
Packing More Brains Into Buds: Multi-Feature AI on Tiny Silicon
Outfitting earbuds with more AI can be a challenge. Learn how compression techniques like sparsity, quantization, and memory-aware scheduling can help smooth the way.
A Summer of Growth: GF Doubles Down on US Stronghold
It's been a busy summer of partnerships, acquisitions, and fab expansions for GlobalFoundries. What does this say about the company's silicon roadmap?
E-Book: What’s on the Power Electrification Horizon?
Download this exclusive eBook and explore the latest in power management, control, and switching ICs. Stay ahead in energy innovation with expert insights from…