Boost automotive DC/DC converter performance with coordinated current sensing and gate driving—enabling higher power density, faster switching, and improved efficiency.
Learn how Intel® Core™ Ultra Processors Series 2 (Arrow Lake), Intel® TCC, and Advantech platforms enable deterministic, AI-ready mixed-criticality edge…
Learn about Wi-Fi 8 features, upcoming test challenges and solutions for the latest standards, including a live demo with Rohde & Schwarz instruments.
New biomedical technologies use earbuds, light-driven interfaces, and microfluidic chips to improve heart monitoring and aging research.
Neuromorphic Edge AI chips mark a fundamental departure from traditional silicon, utilizing brain-inspired, event-driven architectures to enable real-time…
The CAN FD-capable part targets battery management systems and high-voltage industrial buses, integrating signal isolation with bus protection in a single package.
In this article, we explore the operation of a Class D stage with a capacitive load and how it can be used in piezo amplifier design.
Discover how the latest MLCCs from Samsung, Murata, and Kyocera are tackling extreme environments through unprecedented power density and miniaturization.