How to Comply with RED DA, the CRA, and Other New EU Cybersecurity Regulations
Learn how upcoming EU regulations like the Radio Equipment Directive Delegated Act and Cyber Resilience Act will impact IoT product design and compliance.
Introduction to Weaver’s Method for SSB Signal Generation
Learn about the Weaver modulator, an RF circuit that improves on older forms of SSB modulation by removing the need for either sharp bandpass filters or…
OKI Reaches New Heights With a 124-Layer PCB
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.
Poster: What Test & Measurement Instruments Do You Need to Test Your Device?
This poster provides a concise visual guide to essential test and measurement instruments such as oscilloscopes, spectrum analyzers, power supplies, and signal…
Secure Interfaces for Critical Semiconductor Applications
Download the white paper to explore best practices for safeguarding semiconductor interfaces.
Intel and AMD CPUs Prove Interoperable With Marvell’s CXL Portfolio
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.
Rugged, Fast, and Flexible: New Connectors Tackle Tough Environments
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Beyond Copper and Optical, a New Interconnect Eyes Next Gen Data Centers
Both copper and optical interconnects face limitations as choices for next gen data centers. Learn how a third option promises to enable scaling up AI clusters…