Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs
Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along with advanced electronic design automation…
Marvell Meets AI Data Center Needs With 3 nm PAM4 DSP
Marvell leveraged advanced process nodes for its new DSP to address the traditional shortcomings of PAM4.
ST Rolls Out Configurable Power-Management IC for Automotive MCUs
ST prioritized key tenets of automotive design—safety, efficiency, and performance—in the new single-package PMIC.
Super−Exposure Pixel Image Sensors Combat LED Flicker to Improve ADAS Safety
Learn how image sensors using pixel overflow technology provided increased dynamic range and LED flicker mitigation when compared to competing multiple exposure…
DIP Switches: Understanding the Basics
DIP switches come in many forms and offer an array of configurations, sizes, switching mechanisms, and power ratings. This article will help equip designers to…
SRAM PUF - The Secure Silicon Fingerprint
Discover the cutting-edge IP that is revolutionizing the security of chips and connected devices: SRAM-based Physical Unclonable Functions (SRAM PUFs). Learn…
New Position Sensing ICs Simplify Design and Enhance Precision
A new crop of magnetic switches, sensors, and PCB-based position encoders aims to redefine position sensing in automotive, industrial, and robotic designs.
Ensuring NR-NTN Device Performance
Watch this webinar to explore the challenges of developing 5G Non-Terrestrial Networks (NTN), including Doppler shifts, delays, and satellite communications.