Morse Micro Intros Wi-Fi HaLow SoC Claiming Longest Reach
At CES, All About Circuits had an exclusive interview with Morse Micro CEO Michael De Nil. We discussed their new Wi-Fi HaLow SoC and more.
Easing Data Center Burdens, SiTime Launches Differential-Ended Oscillator
The new differential-ended oscillator is the company’s first specifically designed to optimize efficiency in AI data centers.
Ceva Talks AI Products and Partnerships at CES 2025
From its updated neural processing units to partnerships with Oritek Semiconductor, MediaTek, and Bestechnic, Ceva is expanding the footprint of its silicon IP.
Targeting Electrification, R&S Unveils Automotive Radar Tester
At CES 2025, Rohde & Schwarz debuted new test equipment for automotive radar systems, electric drivetrains, and connectivity.
AONDevices Shows Off Sensor Fusion IC Targeting Always-On Designs
Announced at CES, the sensor fusion chip detected over a dozen sound classes while performing wake-word recognition, all within the chip’s ultra-low power envelope.
How To Streamline the IoT Security Lifecycle
Security in IoT systems is both an end-to-end problem and a lifecycle challenge. In this article, learn cost-effective ways to craft an enduring, secure IoT…
Princeton Leverages AI to Take On the Legwork of Wireless Chip Design
As a complement to human creativity, Princeton researchers used deep learning to create faster, high-performance wireless chip designs.
IBM Introduces Co-Packaged Optics, an Optical Link Packaging Scheme
IBM believes its new research may increase the efficiency and density of generative AI computing.