Trillium: Google’s TPU Powerhouse Behind Its New AI Models
Google's sixth-generation tensor processing unit (TPU) stole the company's I/O developer conference stage with its higher-than-ever computing performance.
Infineon Angle Sensors Double Down on Accuracy and Stray Field Immunity
The differential Hall-based angle sensor features intrinsic stray field robustness for automotive designs.
Simulating the Switching Power Dissipation of a CMOS Inverter
When a CMOS inverter switches logic states, power is consumed due to its charging and discharging currents. Learn how to simulate these currents in LTspice.
ADAS-Focused Partnerships and Solutions Blossom
In this roundup, we spotlight a few companies that have announced industry partnerships and products targeted at ADAS and the software-defined vehicle.
Rohde & Schwarz Releases ‘World’s Most Compact Oscilloscope’
In applications where space comes at a premium, Rohde & Schwarz’s newest oscilloscope brings industry-standard performance in a server rack mount.
AMD Quietly Drops New Ryzen Processors Without Integrated Graphics
Amid market trends toward higher integration, AMD has released two new processors that strip things back.
Developing a Smart FPGA Power Solution: A Modular Approach
The task of powering FPGAs is full of complexities. Learn how a modular FPGA approach can enable you to meet tricky challenges including space constraints,…
New Proposals Vie for CHIPS Act Funds for Fabs and Digital Twin R&D
Micron, Polar Semiconductor, and digital twin proposals are slated to receive CHIPS Act funding to help secure the U.S. semiconductor supply chain.