The Cooling Problem That Could Bottleneck AI
A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.
Microchip’s 100/1000BASE‑T1 SPE PHYs Pack Security and Safety Features
The new 100/1000BASE-T1 transceiver families integrate IEEE 802.1AE-2018 frame security and TSN, targeting ADAS, zonal architectures, and industrial automation.
PCIe 7.0 Roundup: Test and Timing Tools Emerge as Ecosystem Takes Shape
To support the transition to PCIe 7.0, three companies have introduced new automated testing applications, ultra-low-jitter clock generators, and protocol…
2026 Design Contest using Phytec’s phyBOARD®-RT1170 Development Kit
Sign up today and start building with the phyBOARD®-RT1170 Development Kit!
Nuvoton Launches Easy-to-Use Tool to Build and Deploy AI on Its MCUs
The new GUI tool comes with features for automated AI development and deployment of Nuvotion MCU firmware.
Sensing at the Control Level: Leveraging Data for Both Safety and Analytics
Kate Sokolnicki, Global Business Director for Sensing & Safety at Rockwell Automation, discusses the evolution of industrial sensing and the shift toward…
Boost the Power Delivery Potential of USB-C Ports with Protection Switches
Learn how innovative technologies like protection switches will be crucial in transitioning to high-power delivery of USB-C ports.
Rohm Announces Compact Wireless Charging Chipset for Wearables
The new NFC wireless charging chipset uses 13.56-MHz technology and an MCU-free architecture to simplify wireless power integration in ultra-compact wearable…