Renesas Debuts Its First Bluetooth LE SoC for Automotive Systems
The release marks Renesas' first AEC-Q100-qualified Bluetooth Low Energy SoC, offering a high level of integration and power efficiency.
The Phasing Method and Hilbert Transforms for Single-Sideband Modulation
SSB modulation improves bandwidth efficiency by eliminating either the upper or lower sideband. Learn about the circuits and mathematics that make this possible…
New Automotive Sensors Drill Down on Control, Precision, and Heat
Allegro Microsystems, TDK, and Diodes Incorporated have released new magnetic sensors to tackle motor control accuracy and thermal management in next-gen vehicles.
ST Releases MPUs Geared to Up Performance in Rugged Designs
The latest variants pack processing resources and on-chip features to deliver sensing, processing, and data-handling roles throughout smart factories, cities, and homes.
Semiconductor Companies Make Strategic Acquisitions to Bolster Portfolios
Siemens, Nokia, Infineon, Onsemi, and Black Semiconductor are making targeted acquisitions to expand their capabilities in manufacturing, connectivity, and…
Infineon Integrates Six Industrial Protocols on the XMC7000 MCU
The XMC7000 MCU now has built-in support for six major industrial protocols, streamlining industrial automation development with unified connectivity.
System Solution Guide: Advanced Driver Assistance Systems
Advanced Driver Assistance Systems (ADAS) leverage a mix of sensors and cameras in vehicles—to detect nearby obstacles or potential driver errors, and respond…
STMicroelectronics Announces Serial EEPROM With Unique ID
The new memory delivers identification and traceability unique with a 128-bit read-only ID, including EEPROM capacities from 32 Kb to 2 Mb.