AI Inferencing in Data Centers: Breaking the Efficiency-Cost Tradeoff
Training and inferencing comprise two crucial aspects of AI processing in datacenters. Learn the differences between the two, and the cost-efficiency issues involved.
Enhancing Automotive Head-Up Display Systems with ROHM’s ML86178 Controller IC
Head-up displays (HUDs) allow drivers to maintain their focus on the road while still accessing important data such as speed, navigation instructions, and…
ROHM’s High Voltage GaN Solutions With EcoGaN
Gallium nitride (GaN) power solutions have a strong foothold in medium-powered applications including consumer electronics, EV onboard chargers (OBCs), and DC/DC…
What Will Sustainable Semiconductor Manufacturing Look Like by 2035?
In a recent report, IDTechEx defined the who, what, and when of sustainable IC and PCB manufacturing.
Using Solar Energy, Researchers Grow Copper Nano Flowers for Clean Fuel
The new method produces clean chemicals and fuels made from CO2, water, and glycerol without any additional carbon emissions.
Congatec’s Modular IoT Platform Secures Connectivity ‘From COM to Cloud’
Based on four preconfigured software building blocks, Congatec's aReady.IOT streamlines and secures data transfer between different systems and devices.
Understanding Power, Performance, and Area Tradeoffs for Analog IC Designs
Learn about three key indicators of semiconductor process technology: power, performance, and area (PPA). We will discuss the trade-offs between these indicators…
Skywater Unwraps CMOS Platform Aimed at Thermal Imaging Designs
The new ThermaView suite supports hybridized focal plane arrays (FPAs) and monolithically fabricated microbolometer FPAs for uncooled imaging.