Decisions Ahead for the Next Generation of Advanced Packaging
Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for…
Siglent Launches 6.5 GHz Network Analyzer for R&D and Production Test
The SNA5000X-E packs S-parameter measurement, time-domain analysis, and eye diagram capability into a chassis weighing under 5.4 kg.
EU’s European Investment Bank Meets the Unique Needs of Semiconductors
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.
U-blox’s New Wi-Fi 6E Module Steps Up When the Airwaves Get Crowded
U-blox built the tri-band Wi-Fi 6E and Bluetooth 5.4 module for secure, high-throughput industrial IoT applications.
Dukosi Releases 2 Solutions for Battery Pack Management
Dukosi is combining cell-level data tracking with a wireless communication architecture to address traceability requirements and reduce wiring complexity in…
Preventing Runt Pulses in Phase/Frequency Detectors
This article explains the importance of incorporating delay into the feedback path of a phase/frequency detector (PFD) and examines its effect on performance.
Nuvoton Unveils MCU With Cortex-M33 Core Aimed at Smart Devices
The NuMicro M3331 series runs at up to 180 MHz and integrates hardware security, CAN FD, and LED control interfaces across packages as small as 4 × 4 mm.
Power Integrations Extends Flyback Topology to 440W With GaN
At APEC 2026, Power Integrations introduced its TopSwitchGaN 440 W, which unites PowiGaN switches with traditional TOPSwitch architecture, simplifying high-power designs.