Renesas Looks to the Future of Automotive With New Memory and SoC Tech
The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.
New Materials Target Interconnect Performance and On-Chip Photonics
New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.
Geehy Launches Arm Automotive MCU for Body and Comfort ECUs
The 40 nm Arm Cortex-M4F device combines 256 KB flash, CAN FD, and ASIL-B positioning for NEV subsystems.
Keysight Launches 3D Interconnect Designer for Chiplets and 3DICs
The W3510E workflow targets pre-layout modeling, EM analysis, and early UCIe and BoW validation for advanced AI infrastructure designs.
Innovative Charge Pump: Capacitor Divider Technology Improves Intermediate Conversion Efficiency
As system power requirements increase due to AI adoption everywhere, systems are continuing to migrate to 48V distribution to reduce I2R interconnect and PCB losses.
Next-Generation Wearable Electronics: Innovations, Challenges, and Future Trends
Explore the latest innovations, challenges, and future trends shaping next‑generation wearable electronics—from advanced materials to AI‑powered sensing.…
Three Ways to Accelerate Cell Layout in DTCO
The device technology co-optimization (DTCO) methodology requires generating large numbers of layouts. This article introduces a few ways of speeding up this…
Vishay Adds 1200 V SiC MOSFET Power Modules in SOT-227 Packages
The five 1200 V SiC MOSFET power modules support up to 200 A for automotive, energy, and industrial systems.