Thermal Research Roundup: New Ways to Store, Move, and Control Heat
Researchers are advancing materials and device concepts that treat heat as something that can be stored, directed, or actively managed, rather than merely dissipated.
Streamlining Design-to-Manufacture for Imaging Devices Tutorial
In this tutorial, we introduce onsemi’s PRISM platform, a pre-optimized reference imaging solution that streamlines camera design by integrating sensors,…
STMicroelectronics Releases USB PD Sink Controller With Hybrid Mode
The new USB Power Delivery sink controller combines hardwired USB-PD operation with a patented hybrid mode to simplify full-feature USB-C sink designs with…
UALinkSec Security Module From Synopsys
Explore how hardware-based encryption and flexible authentication protect accelerator interconnects at scale—without impacting PPA or time-to-market.
Securing AI at the Silicon Level: Synopsys Solutions for a Smarter, Safer Future
Learn how silicon-level security protects AI data, models, and accelerators across edge and data-center environments.
How Low Can You Go? Pushing the Limits of Transistors - Deep Low Voltage Enablement of Embedded Memories and Logic Libraries to Achieve Extreme Low Power
Learn how deep low-voltage enablement of embedded memories and logic libraries can dramatically reduce power while preserving PPA in advanced SoC designs.
Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification
Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.
Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers
The new stepper motor driver adds advanced microstep control to reduce noise, vibration, and power consumption in compact motor systems.