Poster: Wireless Communications Standards
This poster provides a detailed overview of the cellular, non-cellular, IoT and GNSS specifications including 5G NR, 6G, LTE and Wi-Fi as specified by the…
Targeting AI Workloads, Broadcom Reveals ‘World’s First 102.4 Tbps Switch’
Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.
New Power Components Tackle Tough Design Challenges
TDK, Littelfuse, and Novosense have released components targeting scalability, thermal resilience, and EMI issues.
Siemens Unveils AI-Enhanced PCB Design Tools for Mid-Range Users
New software editions bring enterprise-grade functionality to small- and medium-sized teams.
A Quick Guide to Wire Bonding
Wire bonding is the backbone of high-performance, compact electronics—powering everything from advanced sensors to high-density semiconductors. Don’t miss…
Using Instantaneous Frequency to Represent PM and FM Signals
In this article, we’ll explore the mathematical relationship between phase modulation (PM) and frequency modulation (FM). We’ll then learn how a PM modulator…
Meeting the European Union’s Radio Equipment Directive (RED) Cybersecurity Standards
Winbond’s W77Q and W77T secure flash devices offer manufacturers a simple, effective path to compliance with the latest cybersecurity standards under the Radio…
Facial Recognition for Access Control And Time & Attendance Systems
Download the white paper to explore how embedded facial recognition technology enhances security and efficiency in access control and time & attendance systems.