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Cooling Concept Assessment for High Power Step−Down Conversion
There are more electronic control units (ECUs) in vehicles than ever before. This white paper from onsemi explains the underlying significance of using a top cool MOSFET to reduce thermal stress on electronic devices.
White Paper Overview
The electronic control unit (ECU) is the brain of a vehicle to control the electrical systems or subsystems in a car. The automotive original equipment manufacturers (OEMs) need to design ECUs that incorporate a wide range of power capacities to ensure effective thermal management and enhance overall system reliability.
This paper provides a detailed account of tests conducted to measure MOSFET temperatures and generate device thermal profiles for various thermal management approaches. It examines the thermal impact of different factors such as thermal resistance and gap pad thickness and evaluates the effectiveness top-side and bottom-side mounting heat sink designs.
Download this white paper to gain insights into how effective thermal management is critical for high-power step-down conversions in automotive applications.
