Deliver 3D IC Innovations FasterJuly 26, 2022 by Siemens Digital Industries Software
One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes. To overcome these challenges, a growing number of companies are turning to heterogeneous integration and the 3D stacking of ICs and specialized chiplets (implemented in different processes geometries) into 3D ICs. Chiplets are small ICs specifically designed and optimized for operation within a package in conjunction with other chiplets and full-sized ICs.
In this white paper by Siemens, learn how you can use the Siemens heterogenous 3D IC solution to create designs that meet or exceed your PPA goals and improve the differentiation, profitability, and time-to-market of your next market-leading product.
- Breaking through process limitations
- Four 3D IC mega trends
- Innovative methodology
- Workflows deliver the scope and reach of Xcelerator