Industry White Paper

Dispensable Thermal Interface Materials: An Overview

March 17, 2022 by Fujipoly
Topics Covered
  • Reviewing the Basics
  • Dispensable TIM Applications
  • Gap Filler Applications
  • Packaging and Dispensing

White Paper Overview

Thermal interface materials (TIM) are typically placed between two components in an electronic system to enhance their thermal behavior, such as heat flow between an integrated circuit and a heat sink. Proper thermal management minimizes any thermal fluctuations at these interfaces, which in turn reduces structural damage from overheating, leading to reliable, long-term performance of the electronic device over time.

In this white paper from Fujipoly, highlights factors that must be considered when selecting the best TIMs and packaging and dispensement systems.