Dispensable Thermal Interface Materials: An Overview

White Paper Overview

Thermal interface materials (TIM) are typically placed between two components in an electronic system to enhance their thermal behavior, such as heat flow between an integrated circuit and a heat sink. Proper thermal management minimizes any thermal fluctuations at these interfaces, which in turn reduces structural damage from overheating, leading to reliable, long-term performance of the electronic device over time.

This white paper from Fujipoly will provide an overview of dispensable gap fillers and what advantages they can provide over other gap filler products. We cover packaging and dispensing options, and factors that impact flow rates..