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Enabling Efficient Multi-Die Design Implementation and IP Integration
Discover how Synopsys integrates UCIe IP and 3DIC Compiler to enable efficient multi-die design implementation and IP integration, addressing the challenges of advanced 2.5D and 3D technologies for high-performance applications like AI, automotive, and mobile.
White Paper Overview
This white paper explains how Synopsys UCIe IP and 3DIC Compiler are integrated to deliver a pre-verified and pre-tested design reference flow with all the required design deliverables such as automated routing flow, interposer studies, and signal integrity analysis. The combination of the products helps designers efficiently integrate dies, and co-optimize thermal and power integrity to ensure design feasibility and accurate signoff for system-level effects.
Download this white paper to learn how multi-die designs using advanced 2.5D and 3D packaging technologies are revolutionizing the semiconductor industry.
