Industry White Paper

Fusing CMOS IC and MEMS Design for IoT Edge Devices

May 08, 2020 by Mentor


Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved.

But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a MEMS sensor on the same silicon die can seem impossible. In fact, many IoT edge devices combine multiple dies in a single package, separating electronics from the MEMS design.

The Tanner AMS IC design flow accommodates single or multiple die techniques for successful IoT edge device design and verification.

In this white paper by Mentor, a Siemens Business, learn more about the unique challenge of fusing CMOS IC and MEMS design on a single die.

Read White Paper

Already an AAC member? Please Click Here to login.

Fields containing * are required

Basic Info

Please enter basic information for your AAC account. Help us improve our content to suit your needs!

Product Interest*

Please select two or more product interests.

Industry Interests*

Please select two or more industry interests.