High Temperature Analog and Mixed-Signal Solutions Enabled by the Treo Platform

ICs that can operate in high-temperatures play a critical role in applications such as industrial, military, and automotive. This white paper explains how onsemi’s Treo Platform provides a comprehensive product development ecosystem designed for high-temperature use operation. Understand high junction temperature challenges, high temperature device models, how to deal with leakage issues, digital offset compensation techniques, and more.

White Paper Overview

Demand is on the rise for ICs capable of operating in high-temperature environments, including applications in industrial, military, and automotive sectors. High temperatures have a significant impact on the performance, reliability, and safety of ICs, all of which pose challenges that require innovative solutions.

This paper aims to address these challenges by exploring the effects of high temperatures on ICs and discussing design techniques for high-power operation. Learn how to enhance the robustness and longevity of ICs in extreme conditions and optimize the cost of complete solutions.

Download this white paper to learn how onsemi’s Treo Platform provides a comprehensive product development ecosystem designed for high-temperature use — operating across a wide temperature range, up to 175°C. The paper delves into high junction temperature challenges, the relevant high temperature device models of Treo, how to deal with leakage issues, digital offset compensation techniques, and more.