Industry White Paper

Industry Secrets to PCB Thermal Management

February 26, 2020 by Advanced Assembly

White Paper Overview

By allowing a board’s temperature to fluctuate excessively or rise to extremes, the design’s lifespan can drastically reduce. When designing your next printed circuit board, keeping thermodynamic principles in mind is key. 

In this white paper by Advanced Assembly, discover how heat can damage your PCB, heat sources and destinations, and the most important thermal design factors to consider.

Read White Paper:

Already an AAC member? Please Click Here to login.

Fields containing * are required