Industry White Paper

Interconnect inductance extraction for analog and RF IC designs

June 16, 2020 by Mentor Graphics

Overview

Mobile networking is a fundamental need for most of us in the 21st century. In addition to the smartphone revolution, the Internet of Things (IoT) creates a paradigm in which communication is essential across a broad range of activities and devices. New products that rely on interconnectivity are being introduced every day, such as autonomous cars that “speak” to each other to avoid collisions, implanted medical devices that monitor and transmit critical health data, and worldwide computer games that enable tens of thousands of concurrent users.

Communication has evolved significantly across different generations, from 3G to 4G to 5G, with the operating frequency band increasing with each new generation. For 5G technology, that frequency range can exceed 40GHz. Realizing satisfactory performance in the face of these requirements creates a new design specification for integrated circuit (IC) designs.

The increasing operating frequencies for analog and RF designs now require self and mutual inductance extraction to ensure accurate circuit performance and high reliability.

In this white paper by Mentor, a Siemens Business, explore why inductance extraction for interconnect is now essential for accurate post-layout simulations.

Key advantages of using interconnect inductance in analog and RF IC designs include:

  • Ensures accurate circuit performance for analog/RF designs by including interconnect inductance parasitics in the post-layout simulation
  • Improves reliability and performance by enabling designers to address issues such as signal oscillation, reflections in transmission lines, and reduced gain or bandwidth due to inductance parasitics
  • Ability to use automated tools such as Calibre xL which uses a field-solver-based engine, and enables a fully integrated RCCLK extraction within one extraction run, and a single RCCLK netlist result

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