Industry White Paper

Introducing COM-HPC™: The Future of High-end Embedded Computing Applications

October 14, 2020 by Kontron

Whitepaper Overview

In today's Industry 4.0 plants, data centers, and autonomous transport applications, the volume of data currently generated, processed, and stored is on an exponential rise, placing enormous demands on even the latest embedded system architectures. Moreover, the computing industry must anticipate and respond quickly to the challenges and requirements of future technologies and applications. Evolving technologies, such as the 5G standard, autonomous driving, and Industrial Internet of Things (IIoT), require unprecedented computing power and connectivity that only high-performance computing (HPC) systems can provide. 

To meet these requirements, the PCI Industrial Computer Manufacturers Group (PICMG®) is finalizing its new Computer-On-Modules High-Performance Computing (COM-HPC™) standard designed to complement the COM Express® Type 7 standard currently deployed by developers for IoT high-performance edge servers.

This whitepaper by Kontron explores the progression of the PICMG® COM Express® standard and the many benefits of COM-HPC™, including future-proof computing capabilities, scalability, transmission, and network performance. Kontron is a leading embedded computer solutions manufacturer offering developers, system integrators, and OEMs one of the industry’s largest ranges of off-the-shelf boards, SBCs, and COMs for modular embedded computing, from legacy systems to cutting-edge COM-HPC™ solutions.

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